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Hi team,
The application note referenced in the LMR12007 layout guidelines, SNVA054C, gives a thermal approximation equation that yields smaller copper areas for higher power dissipations. The equation in question is equation (4), shown below.
If I were to replace 1.5W of power with 2W or 3W, I get 6.264 sq. inches and 5.592 sq. inches.
Is there a reason the recommended copper area is shrinking with higher power dissipation?
Thanks,
Jacob
Resolved offline. Application Note SNVA951 is another good reference for the SMPS thermal design.