Location of specific heat capacity value of this device: .TPS62130AQRGTTQ1 in VQFN-16 package
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Location of specific heat capacity value of this device: .TPS62130AQRGTTQ1 in VQFN-16 package
The TPS62913 datasheet provides the thermal characteristics of the part in table 6.4 shown below. While this does not give the specific heat capacity, it does show the thermal characteristics of the package for use in determining the junction temperature based on the power dissipated in the package.
Can you provide more information on how you would use the specific heat capacity?
Thanks Steve for the response. I am running a thermal simulation on a customer board with a series of TI components targeted for power dissipation using a new heat spreader. The FEA software requires specific heat capacity and thermal conductivity (inverse of resistivity). Can I contact you directly? I have (8) components to gather data for.
Thanks Steve for the response. I am running a thermal simulation on a customer board with a series of TI components targeted for power dissipation using a new heat spreader. The FEA software requires specific heat capacity and thermal conductivity (inverse of resistivity). Can I contact you directly? I have (8) components to gather data for.
Thanks Steve for the response. I am running a thermal simulation on a customer board with a series of TI components targeted for power dissipation using a new heat spreader. The FEA software requires specific heat capacity and thermal conductivity (inverse of resistivity). Can I contact you directly? I have (8) components to gather data for.