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TPS2557: TPS2557DRBR: Additional Marking on the Silicon

Miranda J
Intellectual 400 points
Part Number: TPS2557

Hi, Customer raised up an interesting question regarding the power-distribution switches TPS2557DRBR die mask and wondered what does additional "FFAB" marking on the silicon mask mean?

Also, are there any differences/variations on the form, fit, function or application between the two? 

Here are details of the slight differences on the die markings:

DC 2108, from wafer site RFB/USA, die mask contains additional marking - "FFAB" 

DC 2028, from Japan/MH8, no "FFAB" on the die mask

Appreciate if you can help provide the explanation and thanks for your time in advance.

Regards,

Miranda

  • 0
    TI__Mastermind 18031 points

    Hi Miranda,

    As far as I know, it should mean a manufacturing site.

    The difference of the mark may mean different manufacturing site.

    For TI's policy, I will first click resolved button.

    If you have any other concern, contact me any time.

    If you think resolved, please help click 'Issue is solved button'.

    Thanks.

  • 0 in reply to Ziv Zhang
    Intellectual 400 points

    Hi ZiV Zhang, thanks for your info. I was searching on TI website as well as PCN and below is what I found:

    https://www.ti.com/support-quality/certifications-and-standards/certifications.html

    https://www.mouser.com/PCN/Texas_Instruments_20130218002.pdf 

    Is the FFAB mentioned on above meaning fab in Freising Germany ? 

    The PCN mentioned that the chip site code (20L) will be TID and chip country code (21L) will be DEU.

    However, going back to the TI label for those DC 2108 components, the actual (20L) showed RFB and (21L) showed USA. And so, a bit confused here. 

    I just want to clarify with a bit more details so that I can explain to the engineering team from the customer end. 

    Thanks for your help.

    Regards,

    Miranda

  • 0 in reply to Miranda J
    TI__Mastermind 18031 points

    Hi Miranda,

    RFAB which is the factory is indeed located in US.

    I am not sure about FFAB. Maybe manufactured in different fab. The IC sometimes will be manufactured in different countries.

    For details, I think you should consult the FAE responsible and ask the information from CQE or quality team.

    For TI's policy, I will first click resolved button.

    If you have any other concern, contact me any time.

    If you think resolved, please help click 'Issue is solved button'.

    Thanks.