Hi Team
When using UCC28C41, cusotmer want to know
1.during normal operation, what is the approximate temperature difference between the UCC28C41DR junction to upper surface case?
2. Is there any corresponding application documents for the calculation of power dissipation of this IC
Best Regards
Hello Gene,
1) TI has a very good app note on IC package thermal metrics: https://www.ti.com/lit/an/spra953c/spra953c.pdf?ts=1624641841890. I think you want to refer to Section 3 on page 8 which discusses PSI-JT. The PSI-JT parameter is specified in the UCC28C41 data sheet in Section 7.4 on page 5. PSI-JT depends on the mechanical package selected.
2) I was able to use Webench Designer to calculate the power dissipation of the UCC28C41. I searched by "Part Number" in Webench designer.
The defaults are shown below. Can you enter your customers specific application values and give this a try?
If I click on "Open Design", and navigate to "Power", I see 59.11mW for the IC power dissipation for the default design.
Regards,
Eric
