We're using the evaluation board with the VQFN package for first tests.
Due to long lead times the VQFN is not available for first development samples so we're using the HTSSOP package instead.
-What would the temperature difference be within the packages (i.e. HTSSOP = 8% then the VQFN)?
-Besides the reference design in datasheet any tips on imrpoving the heat management of the IC?
-
Ask a related question
What is a related question?A related question is a question created from another question. When the related question is created, it will be automatically linked to the original question.
