TPS54360: TPS54360 chip damage (Pin 2 & Pin 8 burnt out)

Bonnie Yin

Part Number: TPS54360

Hi TI,

TI/TPS54360DDAR is used on our company’s products(Vin 48V,Vout 5V). From early of May,2021,we found this TI chip Vin(pin 2) to SW(pin 8) short,pin 2 to GND short,pin8 to GND short, and defect rate went higher and higher ,up to 3%,avg.~1% . And we confirmed the failed chips are concentrated on DC2035 and DC2047. Meanwhile we used DC2112 & DC 2101, and no defects were found.

We sent samples of Vin to SW short to 3rd party for physical analysis. Confirmed melt points were observed between Vin & SW traces. What's the problem with DC 2035 and DC 2047 material?

#1 after the de-cap melt point found between Vin & SW traces.

#2 after de-cap melt point found between Vin & SW traces.

We noticed that from March, there is another customer have same failure symptom for this chip. See as the below picture or via this URL e2e.ti.com/.../tps54360-the-chip-damage.

over 4 years ago

0 Andy Chen over 4 years ago

TI__Mastermind 34875 points

Hi Bonnie,

Can you provide the top marking on the die surface?

Device failed in which condition?

B R

Andy

0 Bonnie Yin over 4 years ago in reply to Andy Chen

Prodigy 10 points

Hi Andy

Please see defects' top marking as below.

Device failed conditions:

Failed during our tests which are powered on by 48V DC adapter. For TI chip/TPS54360,no any noise found on Vin, Ven and Vsw. DC 2112 & DC 2101 were used under totally same processes and applications. However failed chips just are concentrated on DC 2035 & DC 2047.
Environment temperature: 25 celsius ; Humidity:40%~70%RH

B.R

Bonnie

0 Andy Chen over 4 years ago in reply to Bonnie Yin

TI__Mastermind 34875 points

Thanks Bonnie!

I request the top marking on die surface that you sent for failure analysis, NOT the package top marking.

B R

Andy

0 Bonnie Yin over 4 years ago in reply to Andy Chen

Prodigy 10 points

Hi Andy

TI sold TP54360 to us with HSOIC 8 package instead of die. So TI should do investigation/analysis beginning from package level.

From my side, after de-cap,we didn't pay attention and see marking on die surface.Could you tell in which area of die surface you made markings?Please give me one example,then I can read the marking for you.And I want to know what's the help for the root cause investigation?

Currently,the most important thing is that I want to know what's TI's investigation plan for DC 2035 & DC 2047 materials?

B.R

Bonnie

0 Andy Chen over 4 years ago in reply to Bonnie Yin

TI__Mastermind 34875 points

Hi Bonnie,

Pls advise the contact point of TI or distributor's Sales who support your company, we need to trace back the order history.

B R

Andy

0 Bonnie Yin over 4 years ago in reply to Andy Chen

Prodigy 10 points

Hi Andy

Today observed the die surface of the 2 defects which were implemented decapsulation.Below are die top marking for you.

Marking on die: TPS54360 1102

The distributor's sales is Arrow Jenny Chen.

I hope to get full and fast support from TI for root cause investigation soon for DC 2035 & DC2047 materials. However, several days passed, no positive progress from you. Could you tell me your full root cause investigation plan soon? And I also need TI to identify if there is any other suspected DC materials because we need to have solid confidence for other date codes materials.

B.R

Bonnie

0 Andy Chen over 4 years ago in reply to Bonnie Yin

TI__Mastermind 34875 points

Hi Bonnie,

Pls send the phone number and email of Jenny Chen, and your company name to me at any.chen@ti.com.

Did you asked Arrow to request FA in TI lab?

B R

Andy

0 Bonnie Yin over 4 years ago in reply to Andy Chen

Prodigy 10 points

Hello Andy

Already sent Jenny's phone number ,email and our company information to you. We already requested FA from TI lab. .Need you to get more resources to expedite the root cause investigation.

B.R

Bonnie

0 Andy Chen over 4 years ago in reply to Bonnie Yin

TI__Mastermind 34875 points

Hi Bonnie

Thanks!

I will follow up with Jenny and keep you updated.

B R

Andy

0 Bonnie Yin over 4 years ago in reply to Andy Chen

Prodigy 10 points

Hi Andy

As highlighted,the Vin and SW pins short issue is very critical at our company.And it is opened around 3 months.Indeed need you to expedite the root cause investigation soon for defective lots material.Thanks in advance.

B.R

Bonnie

0 Andy Chen over 4 years ago in reply to Bonnie Yin

TI__Mastermind 34875 points

Hi Bonnie,

Let's follow up this case in email. I will close this thread first.

B R

Andy

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TPS54360: TPS54360 chip damage (Pin 2 & Pin 8 burnt out)