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TPS62130A-Q1: Thermal Metrics

Jacob Wyrick
Expert 5635 points
Part Number: TPS62130A-Q1

Hi team,

The Junction-to-Ambient thermal resistance spec in the TPS62130A-Q1 is smaller than the Junction-to-Case thermal resistance. Shown below. 

This seems counterintuitive. Is this accurate? Is there any chance the values are flipped?

Thanks,

Jacob 

  • +1
    TI__Mastermind 21755 points

    Jacob,

    Here is what I have found out from the thermal modeling team: The two tests are unrelated.  Theta-JA assumes a natural convection environment with a 4 layer PCB, so most of the heat is dissipated through the exposed pad and into the board.  Theta-JC (Top) assumes a 1 layer PCB with an infinite heat sink on top of the package designed to force all of the heat to the top of the package. 

    Thanks,
    Amod

  • 0 in reply to Amod Vaze
    TI__Expert 5635 points

    Thanks Amod! It makes sense that, since the testing set ups and assumptions are different, it can yield results like shown.