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TPS54425 Heat Resistance Soldering Profile

Philip
Expert 1510 points
Other Parts Discussed in Thread: TPS54425Hi there, I would like to request “heat resistance for soldering (dipping profile)” for TPS54425. The first one should be >260 degree Celcius, how about the other two? DIP temperature (deg):? Immersion time (sec): ? Times : ? In example: DIP temperature (deg): More than 260 degree Celcius. Immersion time (sec): More than 10secs. Times : More than once. Please kindly advise. Best Regards, Philip
  • 0
    TI__Guru**** 191445 points

    The reflow profile for board assembly using the Texas Instruments PowerPADTM packages does not have to change from that used with conventional plastic packaged parts. The construction of the package does not add thermal mass, and the only new thermal load is due to the increased solder area between the package thermal pad and the thermal land on the PCB. A typical reflow oven profile for fine pitch surface mount packages is shown in. Nitrogen purged, convection reflow is advantageous for this part to PCB assembly to minimize the possibility of solder ball formation under the package body.
    JSTD-020 range of reflow profiles are compatible with TI components. Peak temperatures can be located on the respective device’s moisture sensitivity . TI recommends following the solder paste supplier's recommendations to optimize flux activity and also to achieve proper melting temperatures of the alloy within the guidelines of J-STD-20 and not exceeding the devices moisture sensitivity level.

    7367.J-STD-020C Proposed Std Jan04.pdf

  • 0 in reply to JohnTucker
    Expert 1510 points

    Hi John,

    Thanks for your explanation.

    I understand TPS54425 can go through the reflow soldering..as per J-STD-020.

    Can this part go through wave or dip soldering? or only go through reflow soldering?

    Please kindly advise, thanks.

     

    Best Regards,

    Philip

  • 0 in reply to Philip
    TI__Guru**** 191445 points

    I am certainly not an expert on the manufacturing process, but so far as I know wave solder is primarily applicable for through hole components.  I searched our literature and did not find any information.  further searching reveals that it is not preferable, but may be possible especially for smaller size components.  The temperature requirements are difficult to maintain using wave solder, and the the optimum land pattern may be different than the recommended pattern for reflow.  I would not recommend it, but you will need to consult with your PCB manufacturer about the details of the solder process.