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CSD18532Q5B: Thermal Resistance

Art Mecina
Genius 16655 points
Part Number: CSD18532Q5B

Hello Guys,

Good day.

What is the Theta JC top (thermal resistance from junction to case top) for CSD18532Q5B ?

I found the forum post below, but seems to suggest that the RθJC on the datasheet is for the Junction to board.

(+) CSD18532Q5B: Thermal details - Power management forum - Power management - TI E2E support forums

Thanks and regards,

Art

  • 0
    TI__Mastermind 38090 points

    Hi Art,

    Thanks for the inquiry. The junction-to-case thermal impedance, RθJC, specified in the datasheet is to the thermal pad on the bottom of the package where it is soldered to the PCB. We don't spec RθJC-top to the top of the case. We have measured it for similar size die in the same package it is around 8 to 9°C/W. Hope this helps. Let me know if I can be of further assistance.

    Best Regards,

    John Wallace

    TI FET Applications