LM2586: Solder paste / Stencil Design for TO-263 (7) DDPAK

Terry Gould

Part Number: LM2586

I cannot find any info from TI relating to the recommended paste pattern for this specific 7 pin chip.

I have read this document: Design Summary for 3- and 5-Pin KTT Packages (ti.com) but the LM2586 has a slightly larger pad.

over 3 years ago

0 Brigitte over 3 years ago

TI__Guru 61745 points

Hello Terry,

Please have a look to the possibility of downloading the CAD files from here: https://vendor.ultralibrarian.com/TI/embedded/?gpn=LM2586&package=KTW&pin=7&sid=01781221dcd9000ce8a4587b6c5d03072004b06a00ac2&c=1

You are getting there from the product folder here: https://www.ti.com/product/LM2586#design-development under CAD/CAE symbols and then download.

The downloaded footprint should include what you are searching for.

Best regards,
Brigitte

0 Terry Gould over 3 years ago in reply to Brigitte

Prodigy 10 points

Thanks Brigitte,

I have had a look at the CAD files and the paste area is the same size as the copper, is this a TI recommendation or a default from Ultra Librarian?

I'm concerned about solder voids created by the surface tension of the large ~10x10mm pad, am I over thinking this? Should the paste be the same as the copper or split into smaller sections, is there a TI recommendation or is it up to our assembler?

0 Brigitte over 3 years ago in reply to Terry Gould

TI__Guru 61745 points

Hello Terry,

I expect that this is a recommendation of Ultra Librarian. At the end it is really up to your assembler, even if TI gives a recommendation, the assmebler needs to update it according the paste thickness he is using.

Best regards,
Brigitte

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LM2586: Solder paste / Stencil Design for TO-263 (7) DDPAK