Hi. The data sheet for the TLC5947 shows a land pattern for the QFN package, but not one for the HTSSOP package. Nothing on the product web page, either. Where can I get this? Thanks.
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Hello Rick,
In general if you are searching for CAD data, you can find HTSSOP package CAD data in the TLC5924 folder which uses the same package.
Here attached you can find the package drawing:
and the PowerPad dimensions:
For the right dimensioning of the mask opening and the amount of vias, please have a look to the application note: http://www.ti.com/litv/pdf/slma002g
For DAP 32 pins, the recommended mask opening size is 5.2mm * 11mm with 3*6 vias (Figure 10, page 9).
Best regards,
Brigitte