The footprint for the TPS62400 has fingers on the top and bottom of the exposed pad. Is it possible to use a normal rectangle footprint for the exposed pad i.e. without the fingers?
Would it have any significant impact?
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The footprint for the TPS62400 has fingers on the top and bottom of the exposed pad. Is it possible to use a normal rectangle footprint for the exposed pad i.e. without the fingers?
Would it have any significant impact?
Hi,
The package thermal pad must be soldered to the PCB for optimal thermal and mechanical performance. The short extensions of the thermal pad on top and bottom side can be left unsoldered. However, it is recommended to keep the footprint and follow datasheet recommendations.
I would be curious to know why you would like to avoid the short extensions?
Let me also share an App note :https://www.ti.com/lit/an/slua271b/slua271b.pdf explaining Soldering and Reflow profile for SON packages.
Regards,
Febin
Hi Aniket,
Please make sure that the exposed thermal pad is properly connected and the device operating junction temperature is not exceeding the AMR indicated in the d/s.
If you do not have further questions, I will go ahead and close this thread. Please hit Resolved if you agree.
Regards,
Febin