CSD16570Q5B: CSD16570Q5BT direct replacement

Nikesh Shah

Part Number: CSD16570Q5B
Other Parts Discussed in Thread: CSD16415Q5

Hi,

I am looking for direct replacement for CSD16570Q5BT part. Is footprint same between CSD16570Q5BT and CSD16570Q5. One says Q5B Package and other says Q5 package. Please let me know if any difference.

Thank you,

over 3 years ago

0 John Wallace1 over 3 years ago

TI__Mastermind 33925 points

Hello Nikesh,

Thanks for your interest in TI FETs. The CSD16570Q5B and CSD16570Q5BT are identical devices. The only difference is the quantity on the reel. The CSD16570Q5BT is a small reel with 250 pieces and the CSD16570Q5B is a large reel with 2500 pieces per reel. There is no CSD16570Q5.

Best Regards,

John Wallace

TI FET Applications

0 Nikesh Shah over 3 years ago in reply to John Wallace1

Prodigy 40 points

Hi,

Thanks for your answer. If CSD16570Q5 is not real part, what is this on mouser: https://www.mouser.com/ProductDetail/Texas-Instruments/CSD16415Q5?qs=3jfYfyvUSwCEW%252BKykkLBpg%3D%3D&gclid=Cj0KCQjw8eOLBhC1ARIsAOzx5cHwuOynznfLLYmpsRxlTCg32EgQbZrmQ1Y-zk7lKGxq4MWFlMXaWmcaAv01EALw_wcB

If I buy this, will that be direct replacement for CSD16570Q5BT?

0 John Wallace1 over 3 years ago in reply to Nikesh Shah

TI__Mastermind 33925 points

Hi Nikesh,

The device on Mouser is a different part number, CSD16415Q5, with higher on resistance: 1.15mΩ max vs. 0.59mΩ max at VGS = 10V. The CSD16415Q5 is in a different package but should work with the Q5B PCB footprint with no changes. I'm assuming you're using this for hot swap or OR'ing. The conduction loss will be higher with the CSD16415Q5. You should make sure that the device temperature is still within limits with the added power dissipation if you plan to use this FET in your application. Please let me know if I can be of any further assistance.

Thanks,

John

0 John Wallace1 over 3 years ago in reply to John Wallace1

TI__Mastermind 33925 points

Hi Nikesh,

I checked with our SMT expert regarding placement of a Q5 package on a Q5B PCB footprint. His feedback is given below. Please let me know if you have any questions.

From TI SMT expert:

If we put a CSD16415Q5 (DQH0008A) on the PCB pad
layout for CSD16570Q5B (DNK0008A), there will be an overhang
exceeding 0.4mm JEDEC maximum limit by 0.02mm

From SMT and functional point of view, it is doable.

Just a little risk because of the overhang.

The solder at thermal pad may crack earlier than expected
causing a reliability issue.

	PKG Designator	Pin 1-4	Pin 5-8	Thermal Pad
CSD16570Q5B PKG	DNK0008A	0.56 X 0.41	0.46 X 0.41	3.58 X 4.0
CSD16415Q5 PKG	DQH0008A	0.61 X 0.41	0.61 X 0.41	4.018 X 4.42
Q5B PCB		0.76 X 0.41	0.66 X 0.41	4.24 X 4.0

Best Regards,

John

Power management

Power management forum

CSD16570Q5B: CSD16570Q5BT direct replacement