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LP2954A thermal pad footprint

Fonteneau Xavier
Prodigy 10 points
Other Parts Discussed in Thread: LP2954

The datasheet of LP2954 indicate that the RTHja is 44.3°C/W but I don't the  size of the copper pad. Can somebody tell me the recommended footprint and the value of RTHja associated.

Thanks.

  • 0
    TI__Mastermind 48665 points

    Hello,

    All of the thermal metrics in TI datasheets are simulated using the JEDEC High-K board layout detailed in JESD51-7. Here is a summary of what that layout looks like:

    4718.JEDEC High-K Board.pptx

    The most important consideration for thermal performance is the amount of copper around the part - on the top layer, and the middle and bottom layers connected through thermal vias - and in particular the best contributer is the top layer copper around the part. What we recommend is getting as much ground copper around the part as possible, and using minimum sized thermal vias packed closely together under the thermal pad of the part will provide the best heatsinking through the board. 

    Regards,

    Nick