TPS54360B-Q1: power consumption vs thermal

Hi Mona,

i could not find the curve but here are some design that i can found which have thermal camera

https://www.ti.com/lit/ug/tiduao6/tiduao6.pdf?ts=1639766610519

https://www.ti.com/lit/ug/tidu987/tidu987.pdf?ts=1639766556725

Since the part have thermal pad, it will propagate the heat from the die to the bottom thermal pad of the package

The thermal resistance is lower in this case compared to the thermal resistance going up to the package. Then the thermal will propagate through PCB. 

Webench can also be used to estimate the temperature of the IC for a given operating condition

Thanks

-Arief