TPS563201: TPS563201DDCR - CUP structure

Charles Zhang1

Part Number: TPS563201

Hi Team,

My customer needs to learn if TPS563201DDCR is CUP structure (referring to active circuitry on the die underneath the bond pads) to recognize the material, please kindly help to provide the information.

Thanks.

over 3 years ago

0 Shuai Fan over 3 years ago

TI__Genius 13451 points

Hi Charles!

If you mean the packaging information, you can refer the following application report. It is about SOT23 in TPS56x201 and TPS56x200.

https://www.ti.com/lit/an/slva937/slva937.pdf?ts=1641435960402&ref_url=https%253A%252F%252Fwww.ti.com%252Fproduct%252FTPS563201%253FkeyMatch%253DTPS563201%2526tisearch%253Dsearch-everything%2526usecase%253DGPN

BSR-MV

Shuai

0 Charles Zhang1 over 3 years ago in reply to Shuai Fan

TI__Expert 3450 points

Hi Shuai,

I am referring to circuitry/structure underneath the bond pads, does TPS563201DDCR have active circuitry underneath the bond pads?

Since customer concern about any risk of cracking, they have to know this information.

Thanks.

0 Shuai Fan over 3 years ago in reply to Charles Zhang1

TI__Genius 13451 points

Hi, Charles!

I have understand your question. I will contact our design team for more information.

Shuai

+1 Shuai Fan over 3 years ago in reply to Shuai Fan

TI__Genius 13451 points

Hi, Charles!

It exists active circuitry underneath bond pads. During the R & D process， we did all-round validation and the reliability test. So you don't need to worry about the cracking risk.

Shuai

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TPS563201: TPS563201DDCR - CUP structure