TPS62088: TPS62088YFPR Ball size before reflow

Hi Martin,

The dimensions of the ball are shown in the package drawing on page 26 of the D/S: https://www.ti.com/lit/ds/symlink/tps62088.pdf

Is something else needed in addition?

Chris

Hi Chris:

Thanks for your feedback. Actually, I checked the data sheet before I posted this questions. The information on page 26/27 told me the following. The dimension is ranged from 0.25 to 0.21mm (Page 26) which is based on 0.23 opening (Page 27) after reflow. However, I am looking for the ball size before reflow, so should be only 1 number. Can't be 0.25~0.21mm (Page 26) ? 

I appreciate you checking the D/S Martin.  Surprisingly, some customers either don't check it OR they don't read to the very end of it to find the packaging details.

Let me explain what these pages are meant to help with: pages 26-28 all go together for the YFP package.

Page 26 shows the mechanical dimensions of the part.  I think this is what you are looking for.

Page 27 gives TI's recommendation for designing the land pattern (PCB footprint) for the part on your PCB.

Page 28 gives TI's recommendation for designing the stencil opening (where the solder paste goes) for the part for reflow.

Yes, the 230 um land pad on page 27 matches the typical diameter of the ball on page 26.  If you need one number, you can think of it as a 230 um diameter ball with a +/- 20 um tolerance.  

I hope this helps.  If I doesn't, maybe you can explain what you mean by 'before reflow'?  All the dimensions in the D/S are given before your reflow/SMT of the device onto your PCB.

Thanks,

Chris

Hi Chris, thank for your feedback. Before reflow mean before solder reflow to make solder ball melt. The reason I ask before solder reflow ball diameter is we may rework the package and reball. So I need to know what is original ball diameter, thanks.