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TPS40211: Barrier in designing TPS40211 boost module for EMI effect and heating effect for 24V input and 48V , 3A Output (150W )

Part Number: TPS40211
Other Parts Discussed in Thread: LM5155, LM5156

Hi sir,

I am designing a boost converter of 48V, 3A output with a 24V input power supply. It is a nonisolated dc-dc converter.I have taken design from webench. I have designed this model two times earlier also.

But it gets fail.

In my first design, I haven't considered any design guidelines. And because of that, my module faces the EMI effect. Due to the EMI effect, I am not getting the desired output. I found that above 30mA load I get voltage drop.

so it is totally unreliable for me.

Owing to this I redesigned it by considering design guidelines. in design guidelines, they have said that the output loop should be as small as possible and the switching node should be small. I had done all these things.

and In my second design I am able to overcome the EMI effect. I got desirable output. but the heating effect comes into the picture. as this model is of 150W, so critical components like the inductor, mosfet, and Schottky diode get heated.

owing to this my modules fail for a load above 500mA. I have already asked this question forum and Stefen sir has given me reliable solutions for that.

But now I am redesigning my module again.

Now I am facing a problem where I have to overcome the EMI effect and the Heating effect of the inductor, mosfet, and Schottky diode.

In the above images, you can see the design guide. They have not provided any guidelines for heat dissipation of components mostly mosfet, inductor, and Schottky diode which dissipates significant power.

As my module is 150W, my module generates significant waste power which results in a large amount of heat.

As all components are SMD, I can emit limited heat by mounting a heatsink on them.

I have two to three ways to radiate this heat in the surrounding by increasing copper area, thermal vias, and increasing copper width.

If I increased the copper area of the switching loop and outer loop (where the inductor, mosfet, and Schottky diode are located ) it may radiate a significant amount of heat but at the same time, it becomes a big hotspot for EMI radiation.   

So please provide me the solution for both reducing heating and EMI effect BOOST CONVERTER.

  • Hi Shubham,

    when having an 150W converter and just assuming 92% efficiency this still means that you will have a loss of 12 W.

    This 12 W needs to be handled by the circuit and the heat needs to be radiated.

    So as the efficiency is really key factor you need to calculate the whole circuit and find parts with will give you the best efficiency.

    Getting and efficiency of 96-97% should be possible which will the give you ~4.5W

    You can find a few examples here:

    TI Reference Designs Library

    e.g.:

    PMP7118 reference design | TI.com

    For understanding the circuit optimization and how to do all the calculation i can recommend this paper:

    Topic_3_Lynch.pdf (ti.com)

    When using another device e.g. LM5155 or LM5156, you can also use the quickstart calculator for doing most of the calculations.

    This can be found on the product page under the development section

    LM5155 data sheet, product information and support | TI.com

    As already mentioned, when doing the calculation you will see that the Gate charge for the FET has a much higher influence then the R DS,on.

    So really consider this value.

    E.g. see this FET: BSC065N06LS5ATMA1

    But as you also can see on RthetaJA you still need some copper area to dissipate the heat.

    In addition to that the Inductor and Diode also have losses

    Best regards,

     Stefan

  • Thank you sir for your reply. This information is very useful for me.