TL2575HV-05: Board Layout : KTT(R-PSFM-G5) vs KTT0005B

Kengo.Y

Part Number: TL2575HV-05

Hi team,

We received PCN.
PCN said Package Outline Difference.
In that comment, it says that shift component placement by 1.8mm towards the lead solder pad.

Looking at the board layout, I think it can be implemented without shifting as it is, is this my understanding correct?

Sincerely.
Kengo.

over 3 years ago

0 Elena Gao over 3 years ago

TI__Genius 13735 points

Hi, Kengo,

Could you share the layout you mention ?it's hard to check with out any picture here. Thank you.

Elena

0 Kengo.Y over 3 years ago in reply to Elena Gao

Guru 11245 points

Hi Elena,

Thank you for your quick reply.
It is the same as KTT(R-PSFM-G5) in the datasheet.

I'd like to know if I can replace KTT(R-PSFM-G5) and KTT0005B as it is.

Sincerely.
Kengo.

0 Elena Gao over 3 years ago in reply to Kengo.Y

TI__Genius 13735 points

hi, Kengo,

I have double check the package, pin to pin distance same as 1.7 ，it is ok for EC connect,

please also check the land pattern of your production required.

Elena

0 Kengo.Y over 3 years ago in reply to Elena Gao

Guru 11245 points

Hi Elena,

Thank you so much for your double-check.
I think it has some differences in the Package outline.
What do you think about it?

Sincerely.
Kengo.

+1 Elena Gao over 3 years ago in reply to Kengo.Y

TI__Genius 13735 points

hi, Kengo,

I could only check the pin position and function could work. but we don't have the recommended for the soldering good. I would recommend talking to your PCB or assemble vendors and ask them for advice. some outline mismatch lead issue in assembly, some may not, I am thinking if you need to use different package on one board. the top size of the two package is not same .

Elena

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TL2575HV-05: Board Layout : KTT(R-PSFM-G5) vs KTT0005B