TPS61288: TPS61288RQQR vs TPS61288LRQQR

Hi Mochizuki,

TPS61288LRQQR has 2.5-mm × 3.0-mm QFN package with HotRod Lite option, the cost is reduced in factory. But the two devices have same pin map and package, and is the  same in application.

Hello Eric,

Thank you for your prompt reply.

We understood TPS6122RQQR is utilized HotRod package but TPS6122LRQQR is "HotRod lite" version package.

What is difference between HotRod and HotRod lite. We could not identify the difference of "lite" version.

Is thermal characteristics is 100% same include thermal mass and tangent characteristics?

If so, why do not to produce lower cost "lite" version only?

Regards,

Mochizuki

Hello Eric,

Thank you for your prompt reply.

We understood TPS6122RQQR is utilized HotRod package but TPS6122LRQQR is "HotRod lite" version package.

What is difference between HotRod and HotRod lite. We could not identify the difference of "lite" version.

Is thermal characteristics is 100% same include thermal mass and tangent characteristics?

If so, why do not you produce lower cost "lite" version only?

Regards,

Mochizuki

Hi Mochizuki,

For customer's application, there will be no difference expect Lite version may have better reliability because of improved craftsmanship. The thermal characteristics is the same. Also the Lite version factory cost will be lower. So we also advocate lite version first.

Best Regards,

Eric Yue

Hello Eric,

Thank you for the elaboration.

There is chance, our experienced customer will apply X-ray or De-cap investigation to find out difference between lite version.

Will they see same Dai ID and Same Lead frame with craftsmanship work to improve reliability and production yield?  

Regards,

Mochizuki

HI Mochizuki,

I think the two versions will have differences through X-ray or De-cap, but I am not quite sure about it. I will ask my colleague who is expert to it for help and hope we can update the result early next week. Thanks for your kind patience.

Best Regards,

Eric Yue

Hi Mochizuki,

I have check with my team and customer cannot find out the differences between two versions through X-ray or De-cap, because the the difference is masked during processing. They will see same Dai ID and Same Lead frame. Customer can only find difference between package screen printing.

BR

Eric Yue

Hi Mochizuki,

The two devices are not only p2p, their spec and die are all the same. We cannot share very detailed information, because this is related to TI's manufacturing process details. From customer side, they will see same Dai ID and Same Lead frame, and will not find any differences between them, There is just one slight improved difference in the manufacturing process, which cannot be seen because of subsequent processing.

We cannot share very detailed process information, we can promise there will be no difference in customer application. What is customer's concern now and with what information can two version be recognized as the same required qualification? 

Best Regards,

Eric Yue

Hi Eric,

We had proposed TPS6122LRQQR to the customer for TPS6122RQQR replacement caused by delivery issue.
It is depend on customer's new device qualification team decision but this moment we could not show the evidence those are same device. There is difference manufacturing process.

Regards,

Mochizuki

Hi Mochizuki,

In my opinion, if customer can not find any difference from any aspect (including electrical properties, X-ray...) between the two versions and we can promise there is no difference for application, customer can treat the two chips the same. We cannot show the evidence just because there is only one small step is different which is confidential. If the difference is obvious, we can show it easily of course. Could you please help persuade the customer based on it?

Best Regards,

Eric Yue

Hi Mochizuki,

Thanks for your kind work, please notice me if there is anything more needed from my side. 

BR

Eric Yue