Hi team,
There is a point (18X) where the SOLDER PASTE EXAMPLE is greater than the LAND PATTERN EXAMPLE, is the value of the SOLDER PASTE EXAMPLE (0.75) correct?
Sincerely.
Ryu
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Hi team,
There is a point (18X) where the SOLDER PASTE EXAMPLE is greater than the LAND PATTERN EXAMPLE, is the value of the SOLDER PASTE EXAMPLE (0.75) correct?
Sincerely.
Ryu
Hi Ryu,
Are you asking about page 25 of this D/S: https://www.ti.com/lit/ds/symlink/tpsm82866a.pdf? Tha drawing is for the unreleased RDM package. We will correct the 0.75 dimension there to 0.7 when we release that package option.
You can see this is already corrected on the released RDJ package on page 32.
Thanks,
Chris
Hi Chris,
Let me ask you one more thing.
Do you have the information on p32 when the stencil thickness is 1.2~1.25.
Sincerely.
Ryu
Hi Ryu,
Do you mean that the stencil is 1.2 to 1.25 mm thick? This is more than 10x thicker than the 0.1mm stencil shown on page 32, and I think it is too thick. Can you double check on the units of the thickness?
Chris
Thank you for confirming. Let me check if we can offer any guidance for a thicker stencil.
Chris
Hi Ryu,
Our packaging experts recommend to reduce the stencil openings to maintain the same volume of solder paste as the drawing shows.
In any case, the CM doing the SMT should be checking their process for proper soldering and no opens/shorts of pins. The same is true for this case.
Chris