In the datasheet PACKAGING INFORMATION, the temperature spec of UCC28070DWR is -40-85C, while it defined Tj for -40-125C in the 6.1 Absolute Maximum Ratings, regardless of the package. Could you please help confirm it? Thank you.
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In the datasheet PACKAGING INFORMATION, the temperature spec of UCC28070DWR is -40-85C, while it defined Tj for -40-125C in the 6.1 Absolute Maximum Ratings, regardless of the package. Could you please help confirm it? Thank you.
Hi Li,
Thank you for your interest in the UCC28070.
I am looking into your question regarding the temperature range for the DW package. Please allow a few days for me to get you an answer.
Regards,
Ray
Hi Aki,
I'm sorry, I know it's been a few weeks, but I have not been able to find any data contradictory to what is in the packaging information if the datasheet. To be conservative, I would consider the temperature range in the datasheet for the DW package to be accurate. I will continue to investigate this, but I wanted to get back to you with what I know at this point.
Both the UCC28070 and UCC28070A are available in the TSSOP package. Is there a specific reason you require it in the SOIC package?
Regards,
Ray
Hi Ray,
Thank you for taking care of this. Customer chose SOIC in the 1st version hardware based on their previous experience, but we might have chance to let them change the package in the future. The temperature question was very confused, so customer still waited for our feedback.
Yes, I agree that the temperature range is confusing and I'm sorry I couldn't give you a better answer. The TSSOP is more readily available anyway and the UCC28070A can be substituted for the UCC28070 (in TSSOP) if desired.
Regards,
Rau
Aki,
In general, package can withstand more than 125C. The temp spec in datasheet means that the device performance is ensured in that range, which refers to the IC. It DOES NOT mean the package can only work from -40 to 85C. Tj also refers to IC, not package.
Having said that, per datasheet, customer should implement necessary thermal management to ensure the IC temperature within the spec OR the performance will NOT be guaranteed.
Hope it helps.
Ning