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Hi Kengo,
Can you please share the reason why did the customer do the X-ray? Was there any issue that customer faced? Please let me know in order to be able to help you further.
Thanks!
Best regards
Sneha
Hi Kengo,
Thanks for the reply.
I have some additional questions:
1) Are any of the pins of the device are shorted to each other? For ex: Vin-Sw pin or Sw pin- GND pin?
2) Does the HS FET/LS FET have large RDSon?
3) Are you able to get the body diode voltage across the Sw- Vin and GND- SW? Please Let me know.
Meanwhile, In regard to the x-ray. I will contact the concerned team.
Thanks!
Best regards
Sneha
Hi Kengo,
Could you please elaborate what do you mean by " resistance cannot be measured because it is not implemented"?
Can you share the LTC information in order to check whether there is a risk in those parts? And are these pictures after soldering or the units are freshly out of T/R?
Thanks!
Best regards
Sneha
Hi Kengo,
I have heard back from the team. According to them, as long as any solder residues are within bumps of the same signals it does not cause any concern.
Thanks!
Best regards
Sneha