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Required recommended PCB land pattern design and reflow profile for part# LMZ14203HTZ/NOPB.

HI

 Required recommended PCB land pattern design and reflow profile for part# IC-LMZ14203HTZ/NOPB.

Required below details also

  1. open via hole on thermal pad of PCB are required or not for IC-LMZ14203HTZ/NOPB ?
  2. if PCB had tented thermal pad, is it leads to component failure?