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TPS543C20: Management method according to moisture sensitivity level(s)

JH Shin
Guru 11050 points
Part Number: TPS543C20

Hello,

Please provide a user guide document on how to manage according to the Moisture sensitivity level(s) of TPS543C20RVFR.

My customer would like to know detailed information about when the TPS543C20RVFR should be baked

Thank you.

JH

  • 0
    TI__Mastermind 42060 points

    Hello JH,

    According to our Moisture Sensitivity Level Search Tool, this device is a MSL level 2 device, which has a floor life of 1 year. The floor life is maximum time period from the opening of the moisture barrier bags (MBB) to the final reflow soldering process. If the floor time is exceed, or the Humidity Indicator Card (HIC) indicates excessive moisture after the MBB is opened, then baking is required prior to any reflow process.

    For detailed information on when and how this should be baked, refer to Section 7 Drying of Components and to Table 5 Reference Conditions for Drying Mounted and Unmounted SMD Packages (as per IPC-JEDEC J-STD-033) of our AN-2029 Handling and Process Recommendations document.

    Best Regards,

    Luis Hernandez Salomon