LM53600-Q1: LM53600MQDSXRQ1 & LM53601MQDSXRQ1 Part CTE check

Hsing Shen

Part Number: LM53600-Q1

Hi ,

Can you provide CTE(Coefficient of thermal expansion) and Plating Materials & Thicknesses for LM53600MQDSXRQ1 & LM53601MQDSXRQ1? The customer is asking for the data for checking.

Thank you!

Hsing

over 3 years ago

0 Marshall_Beck over 3 years ago

TI__Mastermind 35210 points

Hello Hsing,

I will check with the product team on this request and get back to you.

0 Marshall_Beck over 3 years ago in reply to Marshall_Beck

TI__Mastermind 35210 points

Helllo Hsing,

Forgot to post back

See below:

Yes, per datasheet the lead finish for these products can be either Sn or NiPdAu.

The thickness for Sn is in the range of 7um to 20um and the thickness for NiPdAu is: Ni 1 – 3um, Pd 0.02um – 0.1um and Au 0.003 – 0.015um.

The CTE for mold compound for TI manufacturing with NiPdAu is 8ppm/C (below Tg) and CTE of the mold compound for external manufacturing is 9ppm/C (below Tg).

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LM53600-Q1: LM53600MQDSXRQ1 & LM53601MQDSXRQ1 Part CTE check