Hello,
We are starting the design of a PCB for an MPPT Charger with the BQ24650 with 4A maximum charging current.
The MPPT charger has the particularity of being encapsulated in epoxy resin (Potting), and therefore with lower thermal dissipation capacity.
We intend to put a soldered heatsink on the PCB, but we would like to know which pin or pins, beyond the exposed pad, where the greatest amount of heat is expected.
Apart from the BQ24650 is heat also expected in the Mosfets that requires additional dissipation ?
Thanks.
