CSD25402Q3A: Thermal Reistance

Hello Tyler,

Thanks for your interest in TI FETs. The junction-to-case thermal resistance, Rθjc (2.3°C/W max) is specified on page 3 of the datasheet. This is measured from the junction to the thermal pad (source) on the bottom of the package. Please visit the link below for more information on how TI tests and specs thermal impedance in our FET datasheets.

https://e2e.ti.com/blogs_/b/powerhouse/archive/2016/06/10/understanding-mosfet-data-sheets-part-6-thermal-impedance

Best Regards,

John Wallace

TI FET Applications