Other Parts Discussed in Thread: TPS62160-Q1, , TPS51200-Q1, LP87564-Q1, DS90UB954-Q1
Hello
We are in a new design and in order to correctly evaluate the thermal behavior of the new design, we are carrying out some thermal simulations.
During the performance of these simulations, some questions have arisen about the thermal information data from datasheets of the following components:
a- TPS62160-Q1
b- TPS57114-Q1
c- TPS51200-Q1
d- LP87564-Q1
e- DS90UB954-Q1
The doubts we have about these thermal information data are:
-
- All these parts are nearly directly placed on the PCB without an air gap. Why do the values for RthJC_bot and RthJB differ that much? Can we use RthJC_bot?
- On components a, b and c , RthJC_top and RthJA are nearly the same (in b & c, JC_top is even larger!). RthJC_top should be way smaller.
Thank you very much in advance for your help!
Best regards,
