TLV70718 PCB footprint

Clay Shoup

I am making the PCB footprint for this TL70718, following page 27 of my datasheet, which shows the land pattern. My problem is that there are several contradicting views of this part. For instance, pages 25 and 26 both say they are showing the bottom view of the part, but the pin numbers don't match up. Please confirm that the land pattern on page 27 is correct for this part.

over 14 years ago

0 Chris Glaser over 14 years ago

TI__Guru**** 150870 points

Sorry for the confusion. Page 1, 5, and 25 of the datasheet are consistent and match the EVM layout: http://focus.ti.com/lit/ug/slvu416/slvu416.pdf This is the correct pinout.

The pin numbers for page 26 are indeed in error for this IC. But the purpose of page 26 is to define the exposed thermal pad, for which the pin numbers have no bearing. I will see if I can get this corrected.

0 Clay Shoup over 14 years ago in reply to Chris Glaser

Intellectual 410 points

i assumed that to be the case but best to verify. Thanks for the quick response.

0 Clay Shoup over 14 years ago in reply to Chris Glaser

Intellectual 410 points

Chris,

Still a little confusion. The board layout drawings on pages 18 & 27 match the part pin markings as on pg26. I agree the EVM matches pages 1,5,25. So the question also becomes are the dimensions shown on pages 18 & 27 correct? They stick out quite a bit from the actual pads on the part.

Thanks,

Clay

0 Chris Glaser over 14 years ago in reply to Clay Shoup

TI__Guru**** 150870 points

Yes, the mechanical parts of page 18 and 27 are correct. This is our recommendation as to how to draw the land pattern for best solderability. Other land patterns may work for you. Just be sure to check with your board manufacturer and assembly shop to see what their capabilities are.

When the pad extends out past the IC, this allows for easy vidual inspection of the solder joint on each pin.

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TLV70718 PCB footprint