TPSM8D6C24: Junction-to-case (top) thermal resistance

IDK

Part Number: TPSM8D6C24

Hello,

I would like to use TPSM8D6C24 with a heatsink and would like to use the junction-to-case (top) thermal resistance to calculate the junction temperature of the part. Can this thermal resistance be provided for this part?

Thanks,
Matthew

over 3 years ago

0 Calan Elaya over 3 years ago

TI__Genius 11545 points

Hello Matthew,

Assuming you are placing the heatsink on the IC, the junction-to-case (top) thermal resistance for this part is 18.9 C/W.

Best,

Calan

0 IDK over 3 years ago in reply to Calan Elaya

Prodigy 230 points

Hi Calan,

Thanks for the response - this thermal resistance is higher than I was hoping for. For full disclosure, can you also provide a junction-to-board or junction-case (bottom) thermal resistance?

Thanks,

Matthew

0 Calan Elaya over 3 years ago in reply to IDK

TI__Genius 11545 points

Hello Matthew,

RthetaJB is not modeled. However, we characterize the following for the module on the bench:

Junction-to-top characterization parameter (PsiJT) is 0.78 C/W.

Junction-to-board characterization parameter (PsiJB) is 9.8 C/W.

Please refer to this article http://www.ti.com/lit/SPRA953

Best,

Calan

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TPSM8D6C24: Junction-to-case (top) thermal resistance