Hi Power Management Team,
The ΘJA value for that package is quoted as 42.9°C/W. ΘJC(bot) is quoted as 4.3°C/W, I’m assuming that somewhere in between those two numbers there is a real thermal resistance based upon the size of the copper that is attached to that bottom pad, and the number of thermal vias that connect the pad to that plane. Do you have any guidance as to how much heat I should be able to dissipate from this package if I connect pin 9 to the 0V plane via a decent number of thermal vias? Thank you for your help.
Best regards,
Nic Gough
