LMG1205: stencil opening, SMT reflow questions

Hello Alan,

This part is a standard WCSP. Therefore, there is nothing out of the ordinary for this part stencil/reflow wise. See this document about the MSL and reflow profile. This part is Level-1-260C-UNLIM also. Lastly, the pitch is 0.4mm and all of the info you would need for this should be in the package information in the datasheet. This page has some helpful links also.

Let me know if your customer has any more questions.

Thanks,

Alex M.

Hello Alan,

It looks like we don't have that data for this package. There is an extremely similar package with that data though. Refer to this document. Also section 4.3 of this document has some guidance on thickness based on aperture ratio. Is there an issue with this specific pattern/package for the PCB manufacturer? I believe they usually handle issues like this. But feel free to let me know if there is a problem.

Thanks,

Alex M.

Hello Alan,

Sure, just add me as a friend on E2E or email me and I can see about getting you in contact with that team. If I find any useful guidance, I will try to share it in this thread as well for future reference. 

Thanks,

Alex M.

Hello Alan,

We've updated the package information, it now includes more stencil data. I figured you would want an update.

Thanks,

Alex M.