TPS65133: Question about layout setup

Will

Prodigy 250 points

Part Number: TPS65133
Other Parts Discussed in Thread: BUF602,

Dear TI experts,

I'm designing a system using the TPS65133 to power a high speed op amp (BUF602).

In my application, Vi comes from 3.7V from a 350mah Lithium battery.

Currently, I have some problems with layout settings.

1. AVIN and PVIN must be connected together on another layer, will shorting these two PINs directly cause any problems?

2. Is there anything wrong with my component layout connections and ground plane design? Do the pads in the middle of the TPS65133 require heat dissipation?

3. Are thermal vias necessary? Because the manufacturer said that punching holes on the pad may cause problems with soldering. Or should I change the vias to small round through hole pads?

My layout setup is shown below.

Since I have other ICs on the front layer, the TPS65133 and its necessary components are on the bottom layer of the PCB.

The three figures below are the layout I set based on the TPS65133EVM.

Bottom Layer

Ground Plane

Front Layer

Best regards,

Will

over 2 years ago

+1 Liaqat Khan over 2 years ago

TI__Mastermind 18550 points

Hello Will,

It is ok to connect AVIN and PVIN together at the pins.

Your component placement seems reasonable.

Center pad of the device should be connected to as much copper as possible. You can reduce the size of the vias or use plugged vias if soldering is a concern.

Kind Regards,

Liaqat

0 Will over 2 years ago in reply to Liaqat Khan

Prodigy 250 points

Hi Liaqat,

Thanks for your reply.

thank you for your reply. So if I'm using plug-in vias, shouldn't I apply thermal relief to the thermal pad area of the ground plane?

Also, does the trace width need to be adjusted? Currently 0.25mm.

Best regards,

Will

0 Liaqat Khan over 2 years ago in reply to Will

TI__Mastermind 18550 points

We do not use thermal relief on the EVM board and our assembly contractor is able to solder the device properly without problems. So I do not think that you need thermal relief but please consult with your board assembly shop to see if they have any concerns and modify accordingly.

Trace width of 0.25mm (~10 mil) should be ok but you can widen it some if there is room to lower the trace resistance for input/output voltage rails.

Kind Regards,

Liaqat

0 Will over 2 years ago in reply to Liaqat Khan

Prodigy 250 points

Ok, thank you.

0 Liaqat Khan over 2 years ago in reply to Will

TI__Mastermind 18550 points

You are welcome.

Liaqat

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TPS65133: Question about layout setup