I have several miscellaneous questions about QFN and SON packages, including land patterns, solder profile, thermal vias, inspection, solder stencil profile, and rework. Where can I get information on this?
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I have several miscellaneous questions about QFN and SON packages, including land patterns, solder profile, thermal vias, inspection, solder stencil profile, and rework. Where can I get information on this?
The application note " QFN/SON PCB Attachment Application Report " http://focus.ti.com/general/docs/litabsmultiplefilelist.tsp?literatureNumber=slua271a contains a wealth of information on the QFN and SON packages.