Hi,
Can you please clarify if the following is true?
It is recommended to select a "solid mask defined pad (SMD)" (chapter 7.2. on DS) -> ok can be done like this and makes sense, but is usually NSMD.
But in Chapter 7.3. it would be the case that the stencil opening is larger than the soldermask opening; this would mean that the tin is even on the solder mask (see picture below, light green), correct?
Regards,
Gokhan