Hi team,
I would like to request for the thermal resistance information ( junction-to-ambient for the package--Rθja) of following devices:
1. TPS76801QDR (SOIC-8)
2. TPS76801QPWP (HTSSOP-20)
Thank you very much.
Tank.Xue
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Hi team,
I would like to request for the thermal resistance information ( junction-to-ambient for the package--Rθja) of following devices:
1. TPS76801QDR (SOIC-8)
2. TPS76801QPWP (HTSSOP-20)
Thank you very much.
Tank.Xue
Hi Tank.Xue,
Andres will get to you as soon as he is able to tomorrow
Regards,
John
Hi Tank.Xue,
The thermal information for TPS768 is found on the second page of the datasheet:
The Derating Factor column is the reciprocal of thermal resistance; the power rating columns give you the max dissipated power the LDO can handle before reaching a junction temperature of 125ºC at different ambient temperatures.
Please look at the table below with the calculated values for thermal resistance:
Package | Derating Factor(mW/ºC) | RθJA(ºC/W) |
SOIC-8 | 5.6818 | 176 |
HTSSOP-20 | 30.7 | 32.6 |
Regards,
Andres