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MC34063AP Soldering Profile and Storage/Baking Conditions

I refer to MC34063AP (1.5A Switching Regulator) datasheet Page 13 and MSDS information from TI site.

a). On the storage and baking conditions, I only have this MSL information from your material content (Refer to link: http://focus.ti.com/quality/docs/searchbypcid.tsp?templateId=5909&navigationId=11220&PCID=28306&OrderablePart=MC34063AP)

. "MSL/Reflow Ratings: Level-NC-NC-NC", may I know what does this mean? Any possibilities for me to have storage and baking conditions for this part?

b). I am looking for some soldering flow/reflow profile/condition and I got this information from your datasheet Page 13 . "MSL Peak Temp: N/A for Pkg Type". May I know what does this mean for this PDIP package?

Thanks and Best Regards.