TPS25927: Why TPS25927 need the thermal foldback mechanism ?

Zhe Ming Zhuang

Prodigy 20 points

Part Number: TPS25927

Hi Mrs. / Mr.

TPS25927 spec. P15 shows the thermal foldback mechanism to make Isc < IOL.

Why TPS25927 need this mechanism ?

My first idea is to prevent quickly thermal overshoot, am i right ?

over 3 years ago

+1 Kunal Goel over 3 years ago

TI__Guru* 79181 points

Hi Zhe,

Can you explain what do you mean by thermal undershoot? Purpose of foldback is just to ensure that device does not hit thermal shutdown faster. By reducing current limit, power dissipation is reduced thus FET junction temp will rise less.

Regards

Kunal Goel

0 Zhe Ming Zhuang over 3 years ago in reply to Kunal Goel

Prodigy 20 points

Hi Kunal,

Thanks for your reply . I just invented a noun "overshoot" to describe suddenly tempeature rise if no thermal foldback.

I think what you respond have resolved my issue.

Thanks !

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TPS25927: Why TPS25927 need the thermal foldback mechanism ?