LM60430: About VIA in the layout example

Ryoma Ohashi

Intellectual 2580 points

Part Number: LM60430

Hi team,

My customer is designing the PCB layout of this device.

They are reffering to the layout example shown in the datasheet and have one question about it.

It seems that the 3 VIAs under the thermal pads (please see the attached figure) are for heat dissipation.

Can they remove this VIAs?

Are this VIAs nessesary from the heat dissipation point of view?

Regards,

Ohashi

over 1 year ago

0 Gui He over 1 year ago

TI__Genius 12365 points

Hi Ohashi

Yes the vias are for heat dissipation and is highly recommended. If they remove the vias , this may cause worse thermal performance than those with vias. Please see below publication:

PowerPAD (TM) Made Easy (Rev. B) (ti.com)

Thanks

0 Ryoma Ohashi over 1 year ago in reply to Gui He

TI__Intellectual 2580 points

Hi Gui,

Thanks for your support and the application note.

I briefly read it but can't find how much the thermal vias influence the heat dissipation.

Do you have a specific number of how much the thermal vias influences the dissipation performance?

Or should the customer measure it by themselves to check whether the thermal vias are needed?

Regards,

Ohashi

+1 Gui He over 1 year ago in reply to Ryoma Ohashi

TI__Genius 12365 points

Hi Ryoma

We don't have specific data for this. But to see the impact for the vias on the thermal performance, you can refer to :

PowerPAD Thermally Enhanced Package (Rev. H) (ti.com)

If customer want to know specific data for the temperature difference, they may need to test on their own board.

Why does customer need to remove the vias?

Thanks

Power management

Power management forum

LM60430: About VIA in the layout example