Please advise on how to connect SGND (=AGND=DGND) with power GND. Most EVMs have control board with UCD3138A and power board with power stage. My customer will have one integrated board for UCD3138A and buck+pushpull power stage. When looking up SLUA779B, it's still unclear for me.
I'm thinking ① would be top layer and ② would be 2nd layer. And customer will place 3rd layer which is power ground plane.
For the connection of 2nd layer and 3rd layer,
(1) Should it be single point? Connection by only one via?
(2) Can via location be directly under the thermal pad of UCD3138A? Or should it be as far as possible to IC?