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BQ79600EVM: Layout question

Marvn Arcangel
Genius 12825 points
Part Number: BQ79600EVM


Hi Team,

I have a question about the layout of the  BQ79600EVM.

1. What is the reason for the ground void in the COMH/COML part of the board? Is this to enhance EMI immunity?
2. The top layer is more removed than the ground layer. What's the reason?

Regards,

Marvin

  • +1
    TI__Expert 3760 points

    Hi,

    Yes, the lack of any signal/ground planes in the daisy chain signal section is to reduce noise. As for the discrepancy between the layers, there must be no ground layer pour underneath the isolation components, but for other parts of the daisy chain it is fine to have it. Hope this helps. 

    Best,

    Nancy