Hi team,
We received PCN(20221216006.1).
It depends on the size of the thermal pad.
1 : Can I get a land pattern drawing of the new land pattern?
2 : Is there any problem mounting the new IC with the old land pattern?
Sincerely.
Kengo.
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Hi team,
We received PCN(20221216006.1).
It depends on the size of the thermal pad.
1 : Can I get a land pattern drawing of the new land pattern?
2 : Is there any problem mounting the new IC with the old land pattern?
Sincerely.
Kengo.
Hi Kengo,
DGQ0010D and DGQ0010H are the epod drawings for this device. You can see the land patterns as a part of the datasheet (pages 48-52). There should be no issue mounting the new IC on the old land pattern.
Best regards,
Stefan
Hi Stefan,
Thank you for your reply.
I understood there is no issue to use the same land pattern.
According to the datasheet,
There is no description of the PCN land pattern.
I can design it by enlarging the side of DGQ0010H. Is there any update to the datasheet?
Sincerely.
Kengo.
Hi Stefan,
Thank you for your support.
And I'm sorry for confusing you.
From PCN, It appears that (2.22~ 1.69) and (1.83~1.45) width lands exist.
The datasheet does not list land of this size, and I'd like to confirm the recommended land for it.
Sincerely.
Kengo.
Hi Kengo,
sorry for the long time it took to sort that out.
The footprint for the two package variants DGQ0010D and DGQ0010H are shown in the datasheet.
The info in the PCN just wanted to show total the min and max of the both package variants together.
Please work with your PCB vender and PCB assembly side to find the right landing size for your setup based on the information given in the datasheet for the two package variants.
Best regards,
Stefan