• State
  • Locked Locked
  • Replies 3 replies
  • Subscribers 63 subscribers
  • Views 161 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TLV704: Thermal data at this set up: Vin=15V, Vout=3.3V@10mA

Harry Ma
Intellectual 1930 points
Part Number: TLV704
Other Parts Discussed in Thread: TLV705

Hi Team

Can you help to provide the thermal data of TLV705 at this set up: Vin=15V, Vout=3.3V@10mA  in our EVM?

  • 0
    TI__Mastermind 43505 points

    Hi Harry,

    What kind of thermal data are you requesting for? The only metric we can easily and accurately measure is the RθJA on the EVM. If we submit for a thermal simulation we can get the others as well, but doing a simulation for a more random board layout like the EVM is more tedious because the thermal modeling engineer has to manually recreate the board layout in their software. 

    Regards,

    Nick

  • 0 in reply to Nick Butts
    TI__Intellectual 1930 points

    Hi Nick

    Thanks for your response.  we wanna know that what is the temperature value of TLV705 at this set up: Vin=15V, Vout=3.3V@10mA  in our EVM with 25℃ ambient temperature.

    But as you said, different layout means different temperature value for same device, that make sense.  I will compare the RθJA between different vendors. Thanks!

  • 0 in reply to Harry Ma
    TI__Mastermind 43505 points

    Hi Harry,

    The purpose of the thermal metrics in the datasheet, which use a standardized JEDEC board layout, are to provide a means of comparing devices. I don't think comparing devices based on the performance on different EVMs is a good way to compare because of the high variability of most of the thermal metrics between layouts. If all you are looking to do is compare device thermal performance between vendors, using the thermal metrics from the JEDEC standard is a much better comparison, and if another vendor does not use the JEDEC board layout for their thermal metrics, this is a sign that they may be dishonest with the thermal performance of their device. 


    Regards,

    Nick