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LMG3422R050: Maximum Power Rating

Donna Langford
Prodigy 70 points
Part Number: LMG3422R050

What is the maximum power rating for part LMG3422R050. If it is footprint or material related, provide the power rating on a metal brd and on a glass board FR4 with the standard footprint and a footprint with extra heat transfer if there is one available.  Also if the power is derated above a certain temperature, what is that and what is the derating. The part will be used on a PCB at 90C.

  • 0
    TI__Expert 8960 points

    Hi Donna,

    The junction to board thermal resistance is 0.88C/W. The junction to ambient thermal resistance will be dependent on an enormous number of factors, including your board layout & airflow. There's no way for TI to calculate it for you.

    At a junction temperature of 125C, the Rdson will increase to ~70mΩ, increasing conduction losses accordingly.

    If you could clarify what you mean by "maximum power rating", I might be able to help more.

    Thanks,

    Travis

  • 0 in reply to Travis Williams
    Prodigy 70 points

    I am referring to the maximum power that the part can tolerate. In the design the part power use must be derated. 

  • 0 in reply to Donna Langford
    Prodigy 70 points

    Maybe the GaN FET has a power rating that is different from the driver?

  • 0 in reply to Donna Langford
    TI__Expert 8960 points

    Hi Donna,

    Maximum power dissipation would be determined by the cooling solution & board layout. The only factors TI controls are the junction to board thermal resistance (0.88C/W) & maximum operating temperature (150C abs max, 125C recommended).

    Maximum power throughput is dependent on topology & implementation. As a low frequency load switch, the max power could be as high as 15kW. As a high step down ratio buck converter, the max power could be as low as a 100W.

    The blocking voltage is 600V, and the max RMS current (at 25C) is 32A. Actual power throughput is determined by application.

    Thanks,

    Travis