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LM61480: maximum force that can be applied on the package

ilan benoliel
Prodigy 40 points
Part Number: LM61480
Other Parts Discussed in Thread: TPS542A52, LMK5C33216, LMX8410L

Hello,

Please advise the maximum force to be applied on the following IC packages, since it appears from the thermal simulations that adding a TIM material will help to dissipate the heat of these ICs:

  • LM61480
  • TPS542A52
  • LMK5C33216
  • LMX8410L

Thank you,

Ilan

  • 0
    TI__Guru 50120 points

    Hello Ilan,

    Let me check with the team for the LM61480. 

    Since I do not cover the other devices, I would suggest you set up individual threads for each GPN so that your question is addressed by the appropriate engineer in a timely manner.

    Regards,

    Jimmy

  • 0 in reply to Jimmy Hua
    TI__Guru 50120 points

    Hello Ilan,

    Just to close this off from my end, I was able to get more feedback from the team. Below are comments for the LM61480

    • HotRod packages are designed for competitive power & heat dissipation thru the PCB. And this is true for this device.
    • The device has no evaluations of TIM/Heatsink or max force applied to the top surface.

    • There is no systematic studies to understand the limits and fail modes for these packages, but using the force that is applied during test, we know these packages are robust against 20-25N force.  If the customer is looking to apply more than that, we do not have any data to confirm how much higher these packages can go.

    Regards,

    Jimmy