TPS25750: Maximum number of reflow cycles

Page 68 of the attached TPS25750 data sheet (tps25750.pdf), table “Packaging Information”, header “MSL Peak Temp”, lists the device as “Level-2-260C-1 YEAR”.

The last line of Section 5 of the attached MSL Ratings and Reflow Profiles document (spraby1a.pdf) states “The IC packages are classified according to J-STD-020 and withstand three reflow cycles.”

Additionally, please take into consideration the below information when performing additional reflow soldering:

The last paragraph of Section 2 of the MSL document states “For IC products with MSL Rating 2 and lower, the floor life needs to also be considered after a first reflow soldering process. Moisture from the environment where the boards are stored will ingress into the package. A bake of the assembled board may be required prior additional soldering process steps, Rework steps and other process steps with temperatures above the local water boiling point.”

tps25750.pdf

1172.spraby1a.pdf