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TPS7B86-Q1: TPS7B8650QDDARQ1 - real life temperature elevation

O'Mellin
Expert 6115 points
Part Number: TPS7B86-Q1

Team,

my customer is looking at dissipating 3.3W from this LDO on a 4layer 1oz copper FR4 : I believe this is the same stack up as the EVM : what temperature elevation can they expect?

Olivier

  • 0
    TI__Guru 50025 points

    Hi Olivier,

    The thermal performance that they get on their board will depend on the layout they use. If there is a lot of same-side copper, via connections to internal layers of more copper, and ideally more copper on the bottom layer, then they can reduce the datasheet thermal metrics by around 30-40%. So with a more thermally optimized board layout like this, they can expect a junction temperature rise of about 41.8C/W * 0.7 * 3.3W = 96C to 41.8C/W * 0.6 * 3.3W = 82C. 

    Are they dissipating 3.3W in the LDO to drop the voltage or is the LDO delivering 3.3W to its load?

    Regards,

    Nick

  • 0 in reply to Nick Butts
    TI__Expert 6115 points

    heloo Nick, You got it right : the 3.3W is the power dissipated in the LDO. thanks