TPSM82821: Beck the board after solder part on board at 125C

Will Wang47

Part Number: TPSM82821

Hi team,

Customer use our TPSM828211SILR, TPSM828214SILR on their product, and after the put the part to board, they plan to beck the board at 125 ℃ for 3h; and the storage temp of TPSM828211SILR, TPSM828214SILR datasheet shows -55℃ to 125℃. So do you think if this is OK for them to do this? Any risk?

Thanks and Best Regards,

Will

over 2 years ago

0 Moheddin Pasha Shaik over 2 years ago

TI__Mastermind 18830 points

Hello Will,

Thank you for using E2E,

You need to take care about the device junction temperature, as long as the device junction temperature is less than 125 ℃ there should not be any problem as specified in the datasheet.

Is the device operated during the bake test?

Thank you,

Regards,

Moheddin.

0 Will Wang47 over 2 years ago in reply to Moheddin Pasha Shaik

TI__Expert 7950 points

Hi Moheddin,

Thanks for feedback, the part will be power off under bake condition.

+1 Moheddin Pasha Shaik over 2 years ago in reply to Will Wang47

TI__Mastermind 18830 points

Hello Will,

There should not be any problem.

Regards,

Moheddin.

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TPSM82821: Beck the board after solder part on board at 125C