Hello expert,
About the layout of lm61460-q1,which pad can transfer the heat best?VIN,PGND or SW?We need to define which PIN get the larger PCB copper layer for best heat dissipation.
In my opinion,VIN is the drain of the internal high side power MOSFET,and SW is the drain of the internal low side power MOSFET, they should share the more area in the chip die and has the best heat dissipation performace.Am I right?